Company Filing History:
Years Active: 2017-2022
Title: Innovations of Inventor Li-Guo Lee
Introduction
Li-Guo Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on innovative semiconductor device structures and manufacturing methods that enhance the efficiency and performance of electronic devices.
Latest Patents
Li-Guo Lee's latest patents include a semiconductor device structure and a manufacturing method. The semiconductor device structure features a semiconductor substrate with a dielectric layer positioned above it. Additionally, it incorporates a conductive trace over the dielectric layer, along with a conductive feature that has a width equal to or larger than the maximum width of the conductive trace. Furthermore, the structure includes a conductive bump situated over the conductive feature. Another notable patent is the method for forming a bump structure, which outlines the process of creating semiconductor structures. This method involves forming a metal pad on a substrate, applying a resist layer with an opening, and creating a conductive pillar with a solder layer. The process concludes with the removal of the resist layer and a portion of the conductive pillar to achieve an angled sidewall.
Career Highlights
Li-Guo Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approach have positioned him as a key player in the development of advanced semiconductor technologies.
Collaborations
Li-Guo Lee has collaborated with notable colleagues, including Yung-Sheng Liu and Yi-Chen Liu, who contribute to the dynamic environment of innovation at their workplace.
Conclusion
Li-Guo Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in electronic devices and manufacturing methods.