Li Fong Chong

Title: Innovations by Li Fong Chong

Introduction

Li Fong Chong is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents, his work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Li Fong Chong's latest patents include a groundbreaking semiconductor package with a releasable isolation layer protection. This innovative semiconductor device features a package body that consists of an encapsulant portion and an isolation structure. The semiconductor die is embedded within the package body, and a plurality of leads protrude from the encapsulant body. The encapsulant portion and the isolation structure are both electrically insulating structures. Notably, the isolation structure has a greater thermal conductivity than the encapsulant portion and is thermally coupled to the semiconductor die. Additionally, a releasable layer is affixed to the semiconductor package, covering the first surface of the isolation structure, which can be released from the semiconductor package.

Career Highlights

Li Fong Chong is currently employed at Infineon Technologies Austria AG, where he continues to innovate in the semiconductor field. His work has contributed to advancements in semiconductor packaging technology, making devices more efficient and reliable.

Collaborations

Li Fong Chong has collaborated with several talented individuals, including Yee Beng Daryl Yeow and Chii Shang Hong. Their teamwork has fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Li Fong Chong's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor devices.