Hsinchu, Taiwan

Li-Chang Yang

This inventor holds 4 USPTO granted patents and 6 published patent applications and 1 EPO patent. Top assignees: Macroblock, Inc., Force Mos Technology Co., Ltd.. Active years: 2022-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Li-Chang Yang. Retrieved from https://idiyas.com/inventor/li-chang-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.3

ph-index = 1


Company Filing History:


Years Active: 2022-2024

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Li-Chang Yang

Introduction: Li-Chang Yang, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Li-Chang Yang holds several patents in the field of semiconductor technology, including a recent patent for a novel method of enhancing chip performance through advanced cooling mechanisms.

Career Highlights: With a career spanning over two decades, Li-Chang Yang has worked for leading tech companies in Taiwan, where he spearheaded research and development projects that have led to the creation of cutting-edge technologies.

Collaborations: Throughout his career, Li-Chang Yang has collaborated with top researchers and engineers in the industry, fostering a culture of innovation and pushing the boundaries of what is possible in the world of semiconductor technology.

Conclusion: Li-Chang Yang's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his position as a respected inventor in the global tech community. His contributions continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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