Lewis R Weiss

Title: **Inventor Profile: Lewis R. Weiss**

Introduction

Lewis R. Weiss is an accomplished inventor based in Scotts Valley, California. He has made significant contributions to the field of integrated circuit packaging technology with his innovative inventions. His passion for developing practical solutions is evident through his patented work.

Latest Patents

One of Weiss's notable patents is for a "Handler for IC Packages," which introduces a package handling apparatus designed for presenting circuit packages to a test head. This advanced system employs a soft handling approach throughout its operation. The handler utilizes multiple sticks, with each stick capable of holding several packages in a substantially horizontal linear array. This design minimizes the risk of damage to the delicate integrated circuits by ensuring that the packages do not come into contact with each other or conventional feeding trays. The system also utilizes controlled drive mechanisms for transport, steering clear of potentially harmful accelerations.

Career Highlights

Lewis R. Weiss is associated with Reid-Ashman Manufacturing, Inc., where he has applied his expertise in integrated circuits and packaging systems. His innovative work on the handler for IC packages has positioned him as a key player in enhancing the precision and efficiency of electronic testing processes.

Collaborations

Throughout his career, Weiss has collaborated with various industry professionals, including notable coworkers Steven J. Reid and Bryan R. Riley. This collaborative environment has fostered innovative thinking and the development of groundbreaking technologies within Reid-Ashman Manufacturing.

Conclusion

Lewis R. Weiss stands out as a dedicated inventor whose work in integrated circuit packaging has revolutionized handling systems. His commitment to innovation and collaboration within his company continues to drive advancements in the field, ensuring safer and more efficient testing methods.