Handler for ic packages

Abstract

A package handling apparatus for presenting circuit packages to a test head is provided which uses a soft handling approach throughout the system. The handler works with a plurality of sticks, with each stick adapted for holding a plurality of packages in a substantially horizontal linear array, with the linear array defining a linear axis for the stick. The handler includes an input elevator element for receiving a first stick loaded with a first package, for moving the first stick vertically to an index level. An input drive moves the first stick horizontally to an index position. A first pick-up removes the first package from the first stick and then moves the first package to a stage pick-up position. A stage element receives the first package, and presents it to the test head for testing. Once tested, the stage element moves the package to a stage exit position. A stage pick-up then places the first package in a stage row stick. A third pick-up then removes the first package from the stage row stick, and places it into a storage row stick in response to a signal from the test head. With this approach, packages are transported and stored in sticks, except when on the stage element. Hence, the packages never contact each other or feed trays. Furthermore, gravity is not used for stick transport. Instead, controlled drive systems are used. Hence, the entire system can be configured to avoid problematic accelerations, and hence reduce potential damage to the delicate integrated circuits being transported.