LeRoy H Hackett

Title: LeRoy H Hackett: Innovator in Micro Electromechanical Systems

Introduction

LeRoy H Hackett is a notable inventor based in Woodland Hills, CA (US). He has made significant contributions to the field of micro electromechanical systems (MEMS) with a total of five patents to his name. His innovative work has paved the way for advancements in sensor technology.

Latest Patents

Among his latest patents is a method for creating a micro electromechanical switch or tunneling sensor. This invention involves defining a cantilevered beam structure and a mating structure on a first substrate or wafer. Additionally, at least one contact structure and a complementary mating structure are defined on a second substrate or wafer. A bonding layer, preferably a eutectic bonding layer, is applied to at least one of the mating structures. The process includes moving the mating structure of the first substrate into a confronting relationship with that of the second substrate, applying pressure to bond the two structures, and subsequently removing the first substrate to allow movement of the cantilevered beam structure.

Career Highlights

LeRoy has worked with various companies, including Solus Micro Technologies, Inc. His experience in the industry has contributed to his expertise in developing innovative technologies.

Collaborations

He has collaborated with notable individuals such as Randall Lynn Kubena and Michael J Little, further enhancing his work in the field.

Conclusion

LeRoy H Hackett's contributions to micro electromechanical systems demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a deep understanding of complex engineering principles and a commitment to pushing the boundaries of what is possible.