Leonard Lucio Mora

Title: Leonard Lucio Mora: Innovator in Integrated Circuit Packaging

Introduction

Leonard Lucio Mora is a notable inventor based in San Jose, CA (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His innovative techniques have advanced the reliability and efficiency of electronic components.

Latest Patents

Mora's latest patents include a "Reinforced sealing technique for an integrated circuit package." This invention involves the insertion of reinforcement pins between the lid and base of a sealed integrated-circuit package. These pins enhance the sealing layer's strength against shear forces. The design includes shorter pins that do not extend through the lid or base, as well as longer pins that do, which are secured and sealed with materials like solder, glass, or epoxy.

Another significant patent is the "Method of assembling and cooling a package structure with accessible chip." This patent describes a package for an integrated circuit that features a die-cavity and a die-attach pad. The design allows for direct cooling of the integrated-circuit die by exposing one side to external cooling media. The mounting surface accommodates various die sizes, ensuring effective cooling through methods such as cooling fluids or heatsinks.

Career Highlights

Throughout his career, Leonard Mora has worked with prominent companies, including VLSI Technology, Inc. and Philips Electronics North America Corporation. His experience in these organizations has contributed to his expertise in integrated circuit technology and packaging solutions.

Collaborations

Mora has collaborated with various professionals in the field, including Ahmad B Hamzehdoost. These partnerships have fostered innovation and the development of advanced technologies in integrated circuit packaging.

Conclusion

Leonard Lucio Mora's contributions to integrated circuit packaging through his patents and career experiences highlight his role as a key innovator in the electronics industry. His work continues to influence the design and functionality of electronic components.