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For the Inventor, By the Inventor

Boise, ID, United States of America

Leonard E Mess

This inventor holds 45 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Micron Technology Incorporated, Round Rock Research, LLC, Other. Active years: 1999-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leonard E Mess. Retrieved from https://idiyas.com/inventor/leonard-e-mess

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 45

% Patents Active = 62.2

Average Co-Inventor Count = 2.1

ph-index = 15

Forward Citations = 1,165(Granted Patents)


Company Filing History:

goldMedal41 out of 39,176 
 
Micron Technology Incorporated
 patents
silverMedal3 out of 428 
 
Round Rock Research, LLC
 patents
bronzeMedal1 out of 834,453 
Other
 patents

Years Active: 1999-2011

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Areas of Expertise:
Semiconductor Device
BGA Assembly
Thermal Applications
Mass Storage
Warpage Reduction
Encapsulation Method
Alignment Features
Interposer
Testing Method
Ceramic FBGA
Stacked Packages
Electronic Devices
45 patents (USPTO):Explore Patents
1. 8049342 - Semiconductor device and method of fabrication thereof (2011-11-01),
2. 7999378 - Semiconductor devices including semiconductor dice in laterally offset stacked arrangement (2011-08-16),
3. 7998792 - Semiconductor device assemblies, electronic devices including the same and assembly methods (2011-08-16),
4. 7829991 - Stackable ceramic FBGA for high thermal applications (2010-11-09),
5. 7704794 - Method of forming a semiconductor device (2010-04-27),
6. 7408255 - Assembly for stacked BGA packages (2008-08-05),
7. 7400032 - Module assembly for stacked BGA packages (2008-07-15),
8. 7396702 - Module assembly and method for stacked BGA packages (2008-07-08),
9. 7375419 - Stacked mass storage flash memory package (2008-05-20),
10. 7285442 - Stackable ceramic FBGA for high thermal applications (2007-10-23),
11. 7279797 - Module assembly and method for stacked BGA packages (2007-10-09),
12. 7262506 - Stacked mass storage flash memory package (2007-08-28),
13. 7229905 - Alignment and orientation features for a semiconductor package (2007-06-12),
14. 7166252 - Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board (2007-01-23),
15. 6900528 - Stacked mass storage flash memory package (2005-05-31),

Title: The Innovative Journey of Leonard E Mess

Introduction: Leonard E Mess, a distinguished inventor hailing from Boise, ID, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Leonard E Mess holds several patents in various technological domains, showcasing his versatility and ingenuity in inventing new solutions to complex problems.

Career Highlights: With a career spanning over two decades, Leonard E Mess has worked tirelessly to bring his ideas to life, revolutionizing industries such as telecommunications, renewable energy, and healthcare along the way.

Collaborations: Throughout his career, Leonard E Mess has collaborated with leading research institutions, universities, and tech companies to further develop and commercialize his inventions, solidifying his reputation as a visionary inventor.

Conclusion: Leonard E Mess's passion for innovation and his relentless pursuit of excellence have cemented his legacy as a pioneering inventor, inspiring future generations to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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