Company Filing History:
Years Active: 2005
Title: Leon M Singleton, Jr: Innovator in Thermal Solder Writing Eutectic Bonding Process
Introduction
Leon M Singleton, Jr. is a notable inventor based in Fullerton, CA (US). He has made significant contributions to the field of semiconductor manufacturing through his innovative patent. His work focuses on improving the efficiency and precision of chip attachment processes.
Latest Patents
Singleton holds a patent for the "Thermal solder writing eutectic bonding process and apparatus." This invention describes a chip or die attachment process where a specific quantity of solder is dispensed onto designated locations on a substrate. An integrated-circuit chip is then precisely positioned at each location immediately after the solder is dispensed. The process utilizes hot gas heaters to heat the solder and the integrated-circuit chip, facilitating the reflow of solder beneath the chip. The solder can be dispensed from a wire spool or as drops from a liquid solder reservoir.
Career Highlights
Leon M Singleton, Jr. is currently employed at Northrop Grumman Systems Corporation, where he continues to innovate in the field of electronics and semiconductor technology. His work has contributed to advancements in manufacturing processes that enhance the reliability and performance of electronic devices.
Collaborations
Some of his coworkers include Dean Tran and Salim Akbany, who collaborate with Singleton on various projects within the company.
Conclusion
Leon M Singleton, Jr. is a distinguished inventor whose contributions to thermal solder writing processes have made a significant impact in the semiconductor industry. His innovative approach continues to influence the way electronic components are manufactured and assembled.