Northrop Grumman Systems Corporation

Leon M Singleton, Jr

Dean Tran

Ronald A DePace

Salim Akbany

Maurice Lowery

A chip or die attachment process and related apparatus, in which a desired quantity of solder (or) is dispensed onto each, in turn, of a number of desired locations on a substrate (or), and then an integrated-circuit chip () is precisely positioned at each location immediately after the solder is dispensed at that location. Hot gas heaters are used both to heat the solder (or) as it is dispensed onto the substrate (or), and to heat the integrated-circuit chip () and to reflow the solder beneath the chip. In one form of the invention, the solder is dispensed from a wire spool () and melted in position on the substrate (). Alternatively, the solder is dispensed as a drop () from a liquid solder reservoir ().

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Fullerton, CA, United States of America

Leon M Singleton, Jr