The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Jun. 05, 2002
Dean Tran, Westminster, CA (US);
Salim Akbany, Diamond Bar, CA (US);
Maurice Lowery, Los Angeles, CA (US);
Leon M. Singleton, Jr., Fullerton, CA (US);
Ronald A. Depace, Mission Viejo, CA (US);
Dean Tran, Westminster, CA (US);
Salim Akbany, Diamond Bar, CA (US);
Maurice Lowery, Los Angeles, CA (US);
Leon M. Singleton, Jr., Fullerton, CA (US);
Ronald A. DePace, Mission Viejo, CA (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
A chip or die attachment process and related apparatus, in which a desired quantity of solder (or) is dispensed onto each, in turn, of a number of desired locations on a substrate (or), and then an integrated-circuit chip () is precisely positioned at each location immediately after the solder is dispensed at that location. Hot gas heaters are used both to heat the solder (or) as it is dispensed onto the substrate (or), and to heat the integrated-circuit chip () and to reflow the solder beneath the chip. In one form of the invention, the solder is dispensed from a wire spool () and melted in position on the substrate (). Alternatively, the solder is dispensed as a drop () from a liquid solder reservoir ().