Company Filing History:
Years Active: 2004-2005
Title: Salim Akbany: Innovator in Semiconductor Bonding Processes
Introduction
Salim Akbany is a notable inventor based in Diamond Bar, California. He has made significant contributions to the field of semiconductor technology, particularly in bonding processes. With a total of 2 patents, his work has advanced the methods used in chip attachment and precious metal plating.
Latest Patents
Akbany's latest patents include the "Thermal solder writing eutectic bonding process and apparatus" and the "Precious alloyed metal solder plating process." The first patent describes a method for attaching integrated-circuit chips to substrates using a precise solder dispensing technique. This process utilizes hot gas heaters to ensure optimal solder flow and chip positioning. The second patent outlines a cost-effective method for plating precious alloyed metals, which minimizes the risk of contamination during semiconductor processing. This innovative approach allows for targeted metal application, avoiding potential short circuits.
Career Highlights
Salim Akbany is currently employed at Northrop Grumman Systems Corporation, where he continues to develop cutting-edge technologies in semiconductor manufacturing. His expertise in soldering techniques has positioned him as a key player in the industry.
Collaborations
Throughout his career, Akbany has collaborated with talented professionals such as Dean Tran and Ronald A DePace. These partnerships have fostered innovation and contributed to the success of various projects.
Conclusion
Salim Akbany's contributions to semiconductor technology through his patents and work at Northrop Grumman Systems Corporation highlight his role as an influential inventor. His innovative approaches to bonding processes continue to shape the future of the industry.