Santa Rosa, Philippines

Leocadio M Alabin

This inventor holds 3 USPTO granted patents. Top assignee: Amkor Technology, Inc.. Active years: 2005-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leocadio M Alabin. Retrieved from https://idiyas.com/inventor/leocadio-m-alabin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 92(Granted Patents)


Company Filing History:


Years Active: 2005-2009

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3 patents (USPTO):Explore Patents

Title: Leocadio M Alabin: Innovator in Semiconductor Packaging

Introduction

Leocadio M Alabin is a notable inventor based in Sta. Rosa, Philippines. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the design and functionality of semiconductor packages, which are crucial in modern electronics.

Latest Patents

One of Alabin's latest patents is titled "Offset etched corner leads for semiconductor package." This invention involves a semiconductor package that comprises a leadframe with an outer frame portion defining a central opening. Within this opening is a die pad that features opposed, generally planar top and bottom surfaces. The leadframe includes a plurality of leads connected to the outer frame, extending into the opening in spaced relation to the die pad's peripheral edge. Notably, some corner leads have an angularly offset distal portion that enhances their functionality.

Another significant patent is "Leadframe strip having enhanced testability." This patent describes a method for fabricating a semiconductor package using a leadframe strip that defines a strip plane and multiple leadframes. Each leadframe includes an outer frame and a die pad, with leads extending toward the die pad. The outer frames are integrally connected, defining connecting bars that facilitate the manufacturing process. The encapsulant material applied to the leadframe strip forms a package strip, which is then electrically isolated through isolation cuts.

Career Highlights

Leocadio M Alabin is currently employed at Amkor Technology, Inc., a leading company in semiconductor packaging solutions. His innovative work has contributed to the advancement of semiconductor technology, making it more efficient and reliable.

Collaborations

Throughout his career, Alabin has collaborated with talented individuals such as Ludovico Estrada Bancod and Gregorio G Dela Cruz. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Leocadio M Alabin's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the electronics industry, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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