Company Filing History:
Years Active: 2022
Title: Innovations of Leo Liu in Thermal Conductors
Introduction
Leo Liu is an accomplished inventor based in Taipei, Taiwan. He has made significant contributions to the field of thermal management through his innovative designs. His work primarily focuses on enhancing the efficiency of electronic components.
Latest Patents
Leo Liu holds a patent for a "Socket with Thermal Conductor." This invention includes apparatuses, systems, and processes related to a socket designed with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB). The socket features a cavity into which a thermal conductor is inserted, allowing for effective heat transfer from the package substrate to the PCB. The PCB may also contain thermal vias to facilitate heat conduction from one side to the other. This patent showcases Liu's commitment to improving thermal management in electronic devices. He has 1 patent to his name.
Career Highlights
Leo Liu is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His role at Intel allows him to work on cutting-edge technologies that shape the future of electronics.
Collaborations
Throughout his career, Leo has collaborated with talented individuals such as Hongfei Yan and Yuan-Liang Li. These collaborations have contributed to the development of innovative solutions in the field of thermal management.
Conclusion
In summary, Leo Liu is a notable inventor whose work on thermal conductors has the potential to significantly impact the electronics industry. His patent for a socket with a thermal conductor exemplifies his innovative spirit and dedication to enhancing technology.