The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Feb. 21, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Hongfei Yan, Mesa, AZ (US);
Yuan-Liang Li, Taipei, TW;
Leo Liu, Taipei, TW;
Chunlei Guo, Folsom, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/42 (2006.01); H01L 23/373 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); G01R 1/0483 (2013.01); H01L 23/367 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 23/49833 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/2009 (2013.01);
Abstract
Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.