Company Filing History:
Years Active: 2003-2009
Title: Innovations of Lee Kian Chai
Introduction
Lee Kian Chai is a prominent inventor based in Singapore, known for his significant contributions to the field of semiconductor packaging. With a total of 10 patents to his name, he has made remarkable advancements that enhance the efficiency and reliability of electronic devices.
Latest Patents
One of his latest patents is a method for fabricating a semiconductor package with multi-layer die contact and external contact. This innovative semiconductor package includes a substrate made of board material, a semiconductor die bonded to the substrate, and an encapsulant covering the die. The package features an array of external contacts formed as multi-layered metal bumps, which are smaller and more uniform than conventional solder balls. These contacts can be fabricated using low-temperature deposition processes, reducing package warpage. Additionally, the external contacts can be shaped by etching to have generally planar tip portions, facilitating bonding to electrodes of a supporting substrate. Another notable patent is related to bow control in an electronic package. This package includes a substrate with a mesh layer to stiffen it, allowing for the mounting of one or more dice. The method involves depositing a metal layer on the substrate's outer surface and etching it to form an opening for mounting the dice.
Career Highlights
Lee Kian Chai works at Micron Technology Incorporated, where he continues to innovate in semiconductor technology. His work has significantly impacted the efficiency of electronic packaging, making devices more reliable and effective.
Collaborations
He collaborates with talented coworkers, including Lee Choon Kuan and Chong Chin Hui, who contribute to the innovative environment at Micron Technology.
Conclusion
Lee Kian Chai's contributions to semiconductor packaging through his patents demonstrate his expertise and commitment to advancing technology. His work not only enhances the performance of electronic devices but also sets a benchmark for future innovations in the field.