The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Jul. 27, 2001
Micron Technology, Inc., Boise, ID (US);
Abstract
A method for packaging semiconductor device assemblies. An assembly is formed which includes a semiconductor die, a tape positioned over the active surface of the die, and a substrate element positioned on an opposite side of the tape from the die. Bond pads of the die are exposed through a slot formed through the tape and an aligned opening formed through the substrate element facilitate the extension of intermediate conductive elements from the bond pads and through the slot and opening, to corresponding contact areas on the substrate element. One or both ends of the slot extend beyond an outer periphery of the die to facilitate introduction of an encapsulant material into a channel or receptacles defined by the slot, opening, and active surface of the semiconductor die. Prior to encapsulation, the side of the opening of the substrate element is sealed opposite the tape with a coverlay to contain the encapsulant material within the channel or receptacle. Assemblies and packages formed by the method are also disclosed.