This inventor holds 1 USPTO granted patent. Top assignee: Chinese Academy of Sciences. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: The Innovative Contributions of Le Luo
Introduction
Le Luo is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of technology, particularly in the area of semiconductor packaging. His innovative methods have paved the way for advancements in various applications, including photoelectric chips and biological detection.
Latest Patents
Le Luo holds a patent for a method to realize flux-free indium bumping. This method involves several steps, including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation, and Ag layer coating. The process is particularly useful in applications where the use of flux is prohibited, such as in the packaging of photoelectric chips with optical lenses, MEMS, and biological detection chips. He has 1 patent to his name.
Career Highlights
Le Luo is affiliated with the Chinese Academy of Sciences, where he has been instrumental in advancing research and development in his field. His work has garnered attention for its practical applications and innovative approaches to complex problems.
Collaborations
Le Luo has collaborated with notable colleagues, including Qiuping Huang and Gaowei Xu. Their combined expertise has contributed to the success of various projects and innovations.
Conclusion
Le Luo's contributions to the field of technology, particularly through his patent for flux-free indium bumping, highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile