Company Filing History:
34 out of 37,972 
2 out of 428 
3 out of 832,843 Years Active: 1994-2020
Title: Innovations of Layne G Bunker
Introduction
Layne G Bunker, based in Boise, ID, is an accomplished inventor with a significant portfolio of 39 patents. His innovations primarily focus on advanced technologies within the field of integrated circuits, displaying his expertise and dedication to enhancing electronic systems.
Latest Patents
Among his latest contributions to technology is the patent for "Apparatus and methods for through substrate via test." This invention revolves around vertically-connected, horizontally-oriented integrated circuits (ICs) that establish electrical connections allowing for efficient signal transfer. By utilizing through substrate vias (TSVs), including through silicon vias, his methods enable the testing and potential replacement of defective TSVs. This innovation demonstrates Layne's commitment to improving the reliability and efficiency of electronic devices.
Career Highlights
Layne has built his career at renowned companies, including Micron Technology Incorporated. His work has consistently contributed to advancements in semiconductor technology, particularly in developing techniques that enhance the functionality of integrated circuits.
Collaborations
During his professional journey, Layne G Bunker has collaborated with notable colleagues such as Brent Keeth and Scott James Derner. These partnerships highlight the collaborative efforts within the field of technology, which often lead to groundbreaking innovations.
Conclusion
Layne G Bunker remains a pivotal figure in the realm of integrated circuit technology. His 39 patents reflect a relentless pursuit of innovation, making substantial impacts on electronic systems and the broader technology landscape. As he continues to work on advancements, Layne's legacy in invention and innovation is firmly established.