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Layne G Bunker

This inventor holds 39 USPTO granted patents, primarily in Dynamic Random Access Memory. Top assignees: Micron Technology Incorporated, Round Rock Research, LLC, Other. Active years: 1994-2020.

USPTO Granted Patents = 39

% Patents Active = 48.7

Average Co-Inventor Count = 2.7

ph-index = 10

Forward Citations = 770(Granted Patents)

Company Filing History:

34 out of 39,149

Micron Technology Incorporated

patents

2 out of 428

Round Rock Research, LLC

patents

3 out of 834,411

Other

patents

Years Active: 1994-2020

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Areas of Expertise:

Dynamic Random Access Memory

Memory Malfunction Prediction

Voltage Generator

Data Compression Circuit

Embedded DRAM Architecture

Wide Data Bus

Programmable Multiplexor

Block Write Circuit

39 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10629502 - Apparatus and methods for through substrate via test (2020-04-21),

2. 10037926 - Apparatus and methods for through substrate via test (2018-07-31),

3. 9318394 - Apparatus and methods for through substrate via test (2016-04-19),

4. 8847619 - Apparatus and methods for through substrate via test (2014-09-30),

5. 8189423 - 256 Meg dynamic random access memory (2012-05-29),

6. 8023350 - Memory malfunction prediction system and method (2011-09-20),

7. 7977962 - Apparatus and methods for through substrate via test (2011-07-12),

8. 7969810 - 256 Meg dynamic random access memory (2011-06-28),

9. 7773441 - Memory malfunction prediction system and method (2010-08-10),

10. 7489564 - 256 Meg dynamic random access memory (2009-02-10),

11. 7477557 - 256 Meg dynamic random access memory (2009-01-13),

12. 7477556 - 256 Meg dynamic random access memory (2009-01-13),

13. RE38955 - Memory device having a relatively wide data bus (2006-01-30),

14. 6934173 - 256 Meg dynamic random access memory (2005-08-23),

15. 6850452 - 256 Meg dynamic random access memory (2005-02-01),

Title: Innovations of Layne G Bunker

Introduction

Layne G Bunker, based in Boise, ID, is an accomplished inventor with a significant portfolio of 39 patents. His innovations primarily focus on advanced technologies within the field of integrated circuits, displaying his expertise and dedication to enhancing electronic systems.

Latest Patents

Among his latest contributions to technology is the patent for "Apparatus and methods for through substrate via test." This invention revolves around vertically-connected, horizontally-oriented integrated circuits (ICs) that establish electrical connections allowing for efficient signal transfer. By utilizing through substrate vias (TSVs), including through silicon vias, his methods enable the testing and potential replacement of defective TSVs. This innovation demonstrates Layne's commitment to improving the reliability and efficiency of electronic devices.

Career Highlights

Layne has built his career at renowned companies, including Micron Technology Incorporated. His work has consistently contributed to advancements in semiconductor technology, particularly in developing techniques that enhance the functionality of integrated circuits.

Collaborations

During his professional journey, Layne G Bunker has collaborated with notable colleagues such as Brent Keeth and Scott James Derner. These partnerships highlight the collaborative efforts within the field of technology, which often lead to groundbreaking innovations.

Conclusion

Layne G Bunker remains a pivotal figure in the realm of integrated circuit technology. His 39 patents reflect a relentless pursuit of innovation, making substantial impacts on electronic systems and the broader technology landscape. As he continues to work on advancements, Layne's legacy in invention and innovation is firmly established.

Profile summary based on public USPTO records.

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