The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Jul. 06, 2018
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Ebrahim H Hargan, Boise, ID (US);
Layne Bunker, Boise, ID (US);
Dragos Dimitriu, Boise, ID (US);
Gregory A. King, Hastings, MN (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/28 (2006.01); G11C 29/02 (2006.01); G11C 29/00 (2006.01); H01L 25/065 (2006.01); G11C 29/50 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01R 31/2853 (2013.01); G01R 31/2894 (2013.01); G11C 29/02 (2013.01); G11C 29/022 (2013.01); G11C 29/025 (2013.01); G11C 29/816 (2013.01); H01L 22/14 (2013.01); H01L 22/22 (2013.01); H01L 25/0657 (2013.01); G11C 2029/5006 (2013.01); H01L 2225/06544 (2013.01); H01L 2924/014 (2013.01);
Abstract
A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.