Richardson, TX, United States of America

Larry A Rehn

This inventor holds 2 USPTO granted patents. Top assignee: Honeywell International Inc.. Active years: 2007-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Larry A Rehn. Retrieved from https://idiyas.com/inventor/larry-a-rehn-zrr0gzd0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2007-2011

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2 patents (USPTO):Explore Patents

Title: Larry A. Rehn: Innovator in Silicon Substrate Technologies

Introduction

Larry A. Rehn is a notable inventor based in Richardson, TX (US), recognized for his contributions to the field of silicon substrate technologies. With a total of 2 patents, he has made significant advancements that enhance the capabilities of silicon materials in various applications.

Latest Patents

One of his latest patents focuses on creating novel structures using deep trenching of oriented silicon substrates. This innovative process utilizes a potassium hydroxide (KOH) etch to produce deep high aspect ratio trenches in (110) oriented silicon substrates. These trenches are strategically designed to be perpendicular to the (111) direction of the silicon substrate's crystal lattice. The resulting structures are instrumental in producing thermally isolating areas and through-wafer electrical connections. The cost-effectiveness of this method is attributed to the ideal capabilities of the KOH etch process when applied to suitable materials at the correct orientations.

Another significant patent by Rehn involves a permalloy bridge with selectable wafer anisotropy using multiple layers. This magnetic sensing method and apparatus consist of several bridge circuits, with each circuit formed on a separate permalloy layer containing multiple permalloy bridge runners. The design allows for the selection of permalloy bridge runners, enabling each to possess a selectable wafer anisotropy. This innovation maximizes the magnetic sensitivity of the sensor and ensures optimal matching between bridges while allowing independent control of wafer anisotropy through multiple bridge circuits.

Career Highlights

Larry A. Rehn is currently employed at Honeywell International Inc., where he continues to develop and refine his innovative technologies. His work has significantly impacted the field of magnetic sensing and silicon substrate applications.

Collaborations

Throughout his career, Rehn has collaborated with notable colleagues, including Jason Chilcote and Perry A. Holman. These partnerships have fostered a collaborative environment that enhances innovation and drives technological advancements.

Conclusion

Larry A. Rehn's contributions to silicon substrate technologies and magnetic sensing have established him as a prominent figure in the field. His innovative patents reflect a commitment to advancing technology and improving efficiency in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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