New Paltz, NY, United States of America

Lannie R Bolde

This inventor holds 25 USPTO granted patents, primarily in Die Removal Technology. Top assignee: International Business Machines Corporation. Active years: 1992-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lannie R Bolde. Retrieved from https://idiyas.com/inventor/lannie-r-bolde

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 60.0

Average Co-Inventor Count = 2.2

ph-index = 8

Forward Citations = 262(Granted Patents)


Location History:

  • New Palte, NY (US) (2001)
  • New Paltz, NY (US) (1992 - 2010)
  • Ulster Park, NY (US) (2015 - 2023)

Company Filing History:


Years Active: 1992-2023

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Areas of Expertise:
Hybrid Cable Assembly
Printed Circuit Card
Die Removal
Soldering Methods
Injection Molded Solder
Cooling Heating Die
Solder Ball Mold
Continuous Casting Solder
Plastic Solder Array
Alignment Verification
Electronic Module Fixture
Cast Metal Seal
25 patents (USPTO):Explore Patents

Title: The Innovative Journey of Lannie R Bolde

Introduction: Lannie R Bolde, a talented inventor hailing from New Paltz, NY, has made significant contributions to the world of innovation with his creative mind and dedication to progress.

Latest Patents: Lannie R Bolde's latest patents include groundbreaking designs in renewable energy technology and sustainable materials, showcasing his commitment to environmental conservation.

Career Highlights: Throughout his illustrious career, Lannie R Bolde has been recognized for his pioneering work in the fields of robotics, automation, and smart devices, earning him a reputation as a visionary in the industry.

Collaborations: Lannie R Bolde has collaborated with leading research institutions and universities to further his innovative projects, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: In conclusion, Lannie R Bolde's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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