The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Oct. 16, 2003
Lannie R. Bolde, New Paltz, NY (US);
Jac A. Burke, Lake Katrine, NY (US);
Kevin C. Gallagher, Wappingers Falls, NY (US);
Howard Hutchinson, Wappingers Falls, NY (US);
Juan C. Jeri, Port Ewen, NY (US);
Lannie R. Bolde, New Paltz, NY (US);
Jac A. Burke, Lake Katrine, NY (US);
Kevin C. Gallagher, Wappingers Falls, NY (US);
Howard Hutchinson, Wappingers Falls, NY (US);
Juan C. Jeri, Port Ewen, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply a loading force to the semiconductor device. The assembly of the substrate and the semiconductor device are loaded into the fixture with the shearing element proximate the semiconductor device, and heating the solder connections of the assembly in the fixture are heated proximate the substrate to a predetermined temperature by applying a heat source to a surface of the substrate distal from the semiconductor device.