L Todd Biggs

Title: L Todd Biggs: Innovator in Electronic Assembly Technology

Introduction

L Todd Biggs is a notable inventor based in Queen Creek, AZ (US). He has made significant contributions to the field of electronic assembly, particularly through his innovative patent that enhances the attachment of semiconductor package substrates to printed circuit boards.

Latest Patents

Biggs holds a patent for an "Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board." This invention features electronic contacts that include spherical cores made of high-melting-temperature copper, along with attachment layers composed of a low-melting-temperature eutectic. The design allows the attachment layers to melt during a reflow process while ensuring that the spherical cores remain intact. This unique approach effectively controls the movement or 'collapsing' of the package substrate toward the printed circuit board, thereby improving the reliability of electronic assemblies. He has 1 patent to his name.

Career Highlights

L Todd Biggs is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to be at the forefront of innovation in electronic assembly technologies.

Collaborations

One of his notable coworkers is Edward L Martin, with whom he has likely collaborated on various projects within the realm of electronic assembly and semiconductor technology.

Conclusion

L Todd Biggs is a distinguished inventor whose work in electronic assembly has made a significant impact on the industry. His innovative patent demonstrates his commitment to advancing technology in the field of electronics.