Company Filing History:
Years Active: 2017
Title: Kyu Won Lee: Innovator in Semiconductor Technology
Introduction
Kyu Won Lee is a prominent inventor based in Kyunggi-do, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device that enhances the efficiency of electronic components.
Latest Patents
Kyu Won Lee holds a patent for a semiconductor device and method of forming a duplex plated bump-on-lead pad over a substrate for finer pitch between adjacent traces. This invention involves a substrate with a conductive layer formed over it. A duplex plated bump-on-lead pad is created on the substrate, and an insulating layer is applied over both the conductive layer and the substrate. The insulating layer is then partially removed using a laser direct ablation process. This design allows for a semiconductor die to be mounted over the substrate, featuring a composite conductive interconnect structure with a pitch ranging from 90-150 micrometers between the bumps.
Career Highlights
Kyu Won Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.
Collaborations
Kyu Won Lee has collaborated with notable colleagues, including Soo Won Lee and Eun Jin Jeong. Their combined expertise has contributed to the success of various projects within the semiconductor industry.
Conclusion
Kyu Won Lee's innovative contributions to semiconductor technology exemplify the importance of research and development in advancing electronic components. His patent reflects a significant step forward in the field, showcasing his dedication to innovation and excellence.