Kyu Hyo Hwang

Title: Innovations of Kyu Hyo Hwang in Semiconductor Technology

Introduction

Kyu Hyo Hwang is a notable inventor based in Gyeongsangbuk-do, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and structures.

Latest Patents

Kyu Hyo Hwang holds a patent for a semiconductor device and die bonding structure. This invention addresses the formation of inter-metal compounds with semiconductor dies or lead frames, which enhances electrical and mechanical properties. The patent describes a semiconductor device that includes a semiconductor die, a barrier layer on the die's surface, a first metal layer on the barrier, a central metal layer on the first layer, and a second metal layer on the central layer. The first and second metal layers have a first melting temperature, while the central metal layer has a second melting temperature that is lower than the first. This innovative structure improves wettability and suppresses the conglomeration of die bonding material.

Career Highlights

Kyu Hyo Hwang is associated with KEC Corporation, where he continues to develop and refine semiconductor technologies. His work has been instrumental in advancing the efficiency and reliability of semiconductor devices.

Collaborations

Some of his coworkers include Jong Hong Lee and Gab Soo Choi, who contribute to the collaborative environment at KEC Corporation.

Conclusion

Kyu Hyo Hwang's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing the field. His work continues to influence the development of more efficient semiconductor devices.