Kyoungmin Lee

Title: Kyoungmin Lee and Three-Dimensional Chiplet Innovation.

Introduction

Kyoungmin Lee is an inventor based in Yongin-si, South Korea, and is associated with Samsung Electronics. His listed patent concerns a system-on-chip design that uses a three-dimensional chiplet structure.

Latest Patents

Lee is credited with 1 patent: “System on Chip Having Three-Dimensional Chiplet Structure and Electronic Device Including the System on Chip.” The invention describes an electronic device with a printed circuit board, a system on chip mounted on the board, and a memory device positioned on the system on chip. The system on chip includes a package substrate, a first die with a logic circuit, and a second die with a logic circuit arranged on the first die.

Career Highlights

Lee’s listed patent reflects work on integrating multiple logic dies into a three-dimensional chiplet-based system-on-chip package. The design is presented as part of an electronic device architecture that also incorporates memory.

Collaborations

The provided information names Daehan Youn and Junho Huh as Lee’s coworkers. Their specific roles in the patent or related work are not stated.

Conclusion

Kyoungmin Lee’s listed invention focuses on a three-dimensional chiplet system-on-chip design associated with Samsung Electronics, highlighting an approach to combining logic dies within an electronic device.