Company Filing History:
Years Active: 2025
Title: Innovations by Kyomuk Lim
Introduction
Kyomuk Lim is a notable inventor based in Sejong-si, South Korea. He has made significant contributions to the field of semiconductor packaging. His work is particularly recognized for its innovative approach to core substrate design.
Latest Patents
Kyomuk Lim holds a patent for a "Core substrate, package structure including the core substrate, and method of manufacturing semiconductor package." This patent describes a package structure that includes a core substrate with a substrate base featuring multiple first and second cavities. It also incorporates blocks within the second cavities, bridge structures connecting the blocks to the substrate base, semiconductor chips in the first cavities, and a molding layer that covers the core substrate and semiconductor chips.
Career Highlights
Kyomuk Lim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to focus on advancing semiconductor technologies and improving packaging methods.
Collaborations
One of his notable collaborators is Myeongho Hong, with whom he has worked on various projects related to semiconductor innovations.
Conclusion
Kyomuk Lim's contributions to semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the industry and pave the way for future innovations.