Samsung Electronics Co., Ltd.

Kyomuk Lim

Seokwoo Yoon

Myeongho Hong

Jangbae Son

A package structure includes a core substrate including a substrate base including a plurality of first cavities and a plurality of second cavities, a plurality of blocks in the plurality of second cavities; and a plurality of bridge structures that extend between each of the plurality of blocks and the substrate base, a plurality of semiconductor chips in the plurality of first cavities, and a molding layer configured to cover the core substrate and the plurality of semiconductor chips, a portion of the molding layer being in the plurality of first cavities and the plurality of second cavities.

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Sejong-si, South Korea

Kyomuk Lim