Greeley, CO, United States of America

Kyle Joseph Palmiscno

This inventor holds 1 USPTO granted patent. Top assignee: Dieterich Standard, Inc.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kyle Joseph Palmiscno. Retrieved from https://idiyas.com/inventor/kyle-joseph-palmiscno-bmkk7upy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Kyle Joseph Palmiscno and an Adapter for Process Piping

Introduction

Kyle Joseph Palmiscno is an inventor associated with Greeley, Colorado, and Dieterich Standard, Inc. His patent work addresses an industrial process assembly designed to connect components with different sealing interfaces.

Latest Patents

Palmiscno is named on 1 patent: “Adapter for Inserting Wafer Ring Between Flanges of Process Piping.” The invention describes an adapter positioned between a wafer and a fitting attached to process piping. Its two sealing surfaces mate with the different sealing surfaces of those components, while its inner bore can match the wafer’s bore diameter. Some embodiments also include an additional adapter on the wafer’s opposite side. The assembly is designed to carry process fluid through the piping.

Career Highlights

The patent reflects work on adapting process-piping assemblies to accommodate components with differing sealing-surface types. Palmiscno is associated with Dieterich Standard, Inc., a company connected to the invention.

Collaborations

The available information identifies Dieterich Standard, Inc. as Palmiscno’s company affiliation. It does not specify additional collaborators.

Conclusion

Kyle Joseph Palmiscno’s patented adapter provides a way to join a wafer and piping fitting with different sealing interfaces while maintaining a passage for process fluid.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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