The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Mar. 27, 2014
Applicant:

Dieterich Standard, Inc., Boulder, CO (US);

Inventor:

Kyle Joseph Palmiscno, Greeley, CO (US);

Assignee:

DIETERICH STANDARD, INC., Boulder, CO (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 1/00 (2006.01); G01D 11/30 (2006.01); G01F 15/18 (2006.01); G01F 1/42 (2006.01); G01F 1/46 (2006.01); F16L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01D 11/30 (2013.01); G01F 15/185 (2013.01); F16L 23/006 (2013.01); G01F 1/42 (2013.01); G01F 1/46 (2013.01);
Abstract

An industrial process assembly for carrying a process fluid conveyed through process piping includes a wafer having a sealing surface of a first type and a fitting having a sealing surface of a second type, different from the first type. The wafer includes a bore for carrying the process fluid and the fitting is attached to process piping. An adapter has a first sealing surface for mating with the sealing surface of the wafer and a second sealing surface for mating with the sealing surface of the fitting. The adapter is positioned between the wafer and the fitting. The adapter further includes an inner bore having a same diameter as the bore of the wafer in some embodiments. An additional adapter is provided on a second side of the wafer in some embodiments.


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