Kyeong Rok Shin

Title: Kyeong Rok Shin: Innovator in Semiconductor Packaging

Introduction

Kyeong Rok Shin is a prominent inventor based in Gwangju, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His innovative designs focus on improving the efficiency and reliability of semiconductor packages.

Latest Patents

Kyeong Rok Shin's latest patents include a wafer-level design and wiring pattern for a semiconductor package. This invention features a semiconductor chip with a chip pad, a first insulating layer with a via hole, and a first wiring pattern connected to the chip pad. Additionally, it incorporates a second insulating layer and wiring pattern, enhancing the overall functionality of the semiconductor package. Another notable patent involves a semiconductor package comprising a first molding layer and a second molding layer with different thermal expansion coefficients. This design ensures effective electrical connections while accommodating the varying thermal properties of the materials used.

Career Highlights

Kyeong Rok Shin is currently employed at Nepes Co., Ltd., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Kyeong Rok Shin collaborates with talented colleagues, including Su Yun Kim and Dong Hoon Oh. Their combined expertise contributes to the innovative projects at Nepes Co., Ltd.

Conclusion

Kyeong Rok Shin is a key figure in the semiconductor industry, with a focus on innovative packaging solutions. His patents reflect his commitment to advancing technology in this critical field.