This inventor holds 1 USPTO granted patent. Top assignee: Asm Technology Singapore Pte Ltd. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Kwok Wah Tong: Innovator in Die Bonding Technology
Introduction
Kwok Wah Tong is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology. His innovative approach has led to the development of a unique die bonding tool that enhances efficiency in the manufacturing process.
Latest Patents
Kwok Wah Tong holds a patent for a die bonding tool and system. The patent describes a die bonding tool that comprises a rigid body and a collet with a die-holding portion. The collet is mechanically coupled to the rigid body by a flexible element, which allows for angular deflection when torque is applied to the collet or to a die held by the collet. Additionally, the patent includes a die bonding system that features an adhesive dispenser, further improving the die bonding process.
Career Highlights
Kwok Wah Tong is currently employed at Asm Technology Singapore Pte Ltd, where he continues to innovate and develop advanced technologies. His work has been instrumental in enhancing the capabilities of die bonding tools, making them more effective and reliable for various applications.
Collaborations
Some of his coworkers include Kwok Yuen Cheung and Jin Hui Meng, who contribute to the collaborative environment that fosters innovation at Asm Technology Singapore Pte Ltd.
Conclusion
Kwok Wah Tong's contributions to die bonding technology exemplify his commitment to innovation and excellence in the field. His patent for the die bonding tool and system showcases his ability to address industry needs effectively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile