Kwangbok Woo

Title: Kwangbok Woo: Innovator in Semiconductor Technology

Introduction

Kwangbok Woo is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods for semiconductor packaging, which are crucial for the advancement of electronic devices.

Latest Patents

Kwangbok Woo's latest patents include a semiconductor package and a method of manufacturing the semiconductor package. The first patent provides a mounting substrate for a semiconductor package, which includes a substrate with multiple insulation layers and wirings. It features first and second substrate pads in a chip mounting region, heat-absorbing pads in a peripheral region, and connection lines that thermally couple the heat-absorbing pads to the second substrate pads. The second patent describes a package-on-package type semiconductor package, which consists of a lower semiconductor package that includes a package substrate, a semiconductor chip, a chip connecting terminal, conductive pillars, and a dam structure with an opening surrounding the semiconductor chip.

Career Highlights

Kwangbok Woo is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the development of advanced electronic products.

Collaborations

Throughout his career, Kwangbok Woo has collaborated with talented individuals such as Donguk Kwon and Jiwon Shin. These collaborations have fostered innovation and creativity in their projects, leading to successful advancements in semiconductor technology.

Conclusion

Kwangbok Woo is a notable inventor whose work in semiconductor packaging has made a significant impact on the electronics industry. His innovative patents and contributions to Samsung Electronics Co., Ltd. highlight his expertise and dedication to advancing technology.