The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
May. 09, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Geunwoo Kim, Asan-si, KR;
Jiwon Shin, Daejeon, KR;
Donguk Kwon, Asan-si, KR;
Wooram Myung, Suwon-si, KR;
Kwangbok Woo, Cheonan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Provided is a mounting substrate for a semiconductor package, including a substrate having an upper surface and a lower surface opposite to each other, the substrate including a plurality of insulation layers and wirings in the plurality of insulation layers, first substrate pads and second substrate pads on the upper surface in a chip mounting region of the mounting surface, heat absorbing pads on the upper surface in a peripheral region of the mounting surface adjacent to the chip mounting region, and connection lines in the substrate, the connection lines being configured to thermally couple the heat absorbing pads and the second substrate pads to each other.