Hsinchu, Taiwan

Kuo-Hua Yang


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Kuo-Hua Yang: Innovator in Semiconductor Technology

Introduction

Kuo-Hua Yang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods in photoresist stripping.

Latest Patents

Kuo-Hua Yang holds a patent for a method of photoresist strip. This method involves providing a semiconductor substrate and performing an immerse step and a strip step. The semiconductor substrate comprises a base, a bonding pad, a protective layer, an under bump metallurgy layer, a patterned photoresist layer, and a bump. The patterned photoresist layer covers the under bump metallurgy layer and a lateral surface of the bump. A first connection interface is formed between the patterned photoresist layer and the lateral surface of the bump, while a second connection interface is formed between the patterned photoresist layer and the under bump metallurgy layer. In the immerse step, the patterned photoresist layer contacts a chemical solution that degrades the bond strength of the first connection interface. Consequently, in the strip step, the semiconductor substrate is scoured by a flow with an appropriate force of impact, which strips the patterned photoresist layer from the base. Kuo-Hua Yang has 1 patent to his name.

Career Highlights

Kuo-Hua Yang is currently employed at Chipbond Technology Corporation, where he continues to advance semiconductor technologies. His work has been instrumental in improving manufacturing processes and enhancing the efficiency of semiconductor devices.

Collaborations

Kuo-Hua Yang has collaborated with notable colleagues, including Cheng-Hung Shih and Hsiang-Pin Hou. Their combined expertise has contributed to the success of various projects within the semiconductor industry.

Conclusion

Kuo-Hua Yang is a key figure in semiconductor innovation, with a focus on improving photoresist stripping methods. His contributions continue to shape the future of semiconductor technology.

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