Company Filing History:
1 out of 200 
2 out of 832,912 Years Active: 2014-2015
Title: Kuo-Hua Liu: Innovator in Chip Packaging Technology
Introduction
Kuo-Hua Liu is a prominent inventor based in Pingzhen, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip packaging methods. With a total of 3 patents to his name, Liu's work has advanced the efficiency and effectiveness of chip manufacturing processes.
Latest Patents
Liu's latest patents include innovative methods for chip packaging. One notable patent is for a manufacturing method of a chip package. This method involves providing a semiconductor wafer with multiple device regions separated by scribe lines. The process includes bonding a package substrate to the wafer, with a spacer layer that defines cavities exposing the device regions. The method also incorporates filling adhesive material in through holes and dicing the wafer to create individual chip packages.
Another significant patent is a wafer packaging method. This method entails grinding the first surface of a wafer opposite the integrated circuit units. It also involves forming a release layer on a light transmissive carrier and using an ultraviolet temporary bonding layer to adhere the carrier to the wafer. The process concludes with the removal of the light transmissive carrier and the release layer.
Career Highlights
Throughout his career, Kuo-Hua Liu has worked with various companies, including Xintec Corporation. His expertise in semiconductor technology has positioned him as a key player in the industry, contributing to advancements in chip packaging techniques.
Collaborations
Liu has collaborated with notable professionals in his field, including Yi-Ming Chang and Yu-Lin Yen. These collaborations have further enriched his work and have led to innovative solutions in chip packaging.
Conclusion
Kuo-Hua Liu's contributions to chip packaging technology have made a significant impact on the semiconductor industry. His innovative patents and collaborative efforts continue to shape the future of chip manufacturing.