Kaohsiung, Taiwan

Kuo Hsien Liao

This inventor holds 3 USPTO granted patents. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2015-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo Hsien Liao. Retrieved from https://idiyas.com/inventor/kuo-hsien-liao-966ebkw9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2015-2019

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3 patents (USPTO):Explore Patents

Title: Kuo Hsien Liao: Innovator in Semiconductor Technology

Introduction

Kuo Hsien Liao is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative semiconductor device packages and methods of manufacturing them.

Latest Patents

One of Kuo Hsien Liao's latest patents is a semiconductor device package and method of manufacturing the same. This invention includes a carrier, an electronic component disposed over the top surface of the carrier, and a package body that covers the electronic component. Additionally, it features a shield layer that consists of a first magnetically permeable layer, a first electrically conductive layer, and a second magnetically permeable layer. The unique aspect of this design is that the permeability of the first electrically conductive layer differs from that of the magnetically permeable layers, enhancing the device's performance.

Another notable patent by Liao is similar in nature, focusing on the structure of the semiconductor device package. It emphasizes the arrangement of the shield layer, which includes a first magnetically permeable layer interposed between the first and second electrically conductive layers. This innovative approach aims to improve the efficiency and reliability of semiconductor devices.

Career Highlights

Kuo Hsien Liao is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

Throughout his career, Liao has collaborated with talented individuals such as Cheng-Nan Lin and I-Chia Lin. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Kuo Hsien Liao's contributions to semiconductor technology through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as an influential inventor in the field. His innovative designs continue to shape the future of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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