Hsinchu, Taiwan

Kuo-hao Pao

This inventor holds 1 USPTO granted patent. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo-hao Pao. Retrieved from https://idiyas.com/inventor/kuo-hao-pao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kuo-hao Pao and an Embedded-Shield Printed Circuit Board Method.

Introduction

Kuo-hao Pao is an inventor based in Hsinchu, Taiwan. His patent work includes a method for manufacturing printed circuit boards with an embedded shield, addressing the integration and reliability of shielding in electronic devices.

Latest Patents

Pao’s listed patent, “Method for Manufacturing a Printed Circuit Board with an Embedded Shield,” describes forming trenches on a printed circuit board, filling them with solder paste, and soldering a shield and frame into the board. The approach is intended to create a reliable, integrated shield that supports more intricate electronic designs. The provided data lists 1 patent.

Career Highlights

The available information highlights Pao’s contribution to printed circuit board manufacturing. His patented method focuses on integrating shielding into the board through a defined trench-and-soldering process.

Collaborations

No collaboration details were provided in the available information.

Conclusion

Kuo-hao Pao’s patent presents a manufacturing approach for embedding a shield in a printed circuit board, with the goal of improving integration and reliability in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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