The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Dec. 29, 2023
Applicant:
Hitron Technologies Inc., Hsinchu City, TW;
Inventors:
Kuo-Hao Pao, Hsinchu City, TW;
Yu-Cheng Lin, Hsinchu City, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 3/3494 (2026.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3494 (2013.01); H05K 1/023 (2013.01); H05K 9/0024 (2013.01); H05K 3/0026 (2013.01); H05K 3/0044 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10371 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/143 (2013.01);
Abstract
This invention introduces an advanced method for manufacturing printed circuit boards (PCBs) featuring an embedded shield, enhancing the integrity and functionality of electronic devices. The process involves forming trenches on the PCB, filling them with solder paste, and seamlessly integrating a shield with a frame through a meticulous soldering procedure. This refined technique offers superior reliability and paves the way for more intricate and robust electronic designs.
Pao, Kuo-Hao. (2026). Method for manufacturing a printed circuit board with an embedded shield (U.S. Patent No. 12690139). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12690139
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile