Kuo-Chuan Chen

Title: **Innovative Contributions of Inventor Kuo-Chuan Chen**

Introduction

Kuo-Chuan Chen is a prominent inventor based in Hsinchu, Taiwan, known for his significant contributions to the field of semiconductor packaging. With a total of six patents to his name, Chen's innovative techniques are pivotal in enhancing the reliability and performance of integrated circuit (IC) devices.

Latest Patents

Among his latest innovations are two noteworthy patents. The first is a "Method for forming a wafer level package," which discloses a process for creating a wafer-level package equipped with solder balls on its top surface, encapsulated by an elastomeric stress buffer layer. This method involves forming solder balls on bond pads, then encapsulating them with a flexible material layer, allowing for reliable electrical connections to circuit boards. This invention ensures the integrity and reliability of IC devices after separation from the wafer.

The second patent is a "Method for forming solder bumps for flip-chip bonding by using perpendicularly laid masking strips." This process enables the formation of solder bumps that maintain uniform height, vital for effective flip-chip bonding. By utilizing solder non-wettable masking strips, Chen’s method streamlines the production of solder bumps, enhancing the efficiency of semiconductor fabrication.

Career Highlights

Kuo-Chuan Chen is affiliated with the Industrial Technology Research Institute, where he focuses on research and development in semiconductor technology. Through his innovative approaches, Chen has established himself as a key player in advancing semiconductor packaging methodologies which are crucial for modern electronics.

Collaborations

In his endeavors, Chen has collaborated with talented colleagues including Ling-Chen Kung and Jyh-Rong Lin. Their combined expertise and innovative spirit contribute to the cutting-edge research being conducted at the Industrial Technology Research Institute, pushing the boundaries of technology forward.

Conclusion

Kuo-Chuan Chen's contributions to the field of semiconductor packaging through his various patents highlight his role as an influential inventor. His methods not only improve manufacturing processes but also enhance the performance and reliability of semiconductor devices, marking important advancements in the industry. As technology continues to evolve, innovators like Chen will play a crucial role in shaping the future of electronics.