This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: Kuo-Ching “Steven” Hsu: Innovator in Integrated Circuit Technology
Introduction
Kuo-Ching “Steven” Hsu is a notable inventor based in Chung-Ho, Taiwan. He has made significant contributions to the field of integrated circuit technology, particularly through his innovative patent related to through-silicon vias.
Latest Patents
Steven Hsu holds a patent for "Through-silicon vias and methods for forming the same." This patent describes an integrated circuit structure that includes a substrate, a through-silicon via (TSV) extending into the substrate, a TSV pad spaced apart from the TSV, and a metal line that electrically connects the TSV and the TSV pad. This invention enhances the performance and efficiency of integrated circuits.
Career Highlights
Steven Hsu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing technologies that improve integrated circuit designs and manufacturing processes.
Collaborations
Steven has collaborated with esteemed colleagues, including Chih-Hua Chen and Chen-Shien Chen, contributing to various projects that push the boundaries of semiconductor technology.
Conclusion
Kuo-Ching “Steven” Hsu is a prominent figure in the field of integrated circuits, with a valuable patent that showcases his innovative spirit and technical expertise. His contributions continue to influence the semiconductor industry significantly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile