Yilan, Taiwan

Kuo-Chang Wu

This inventor holds 1 USPTO granted patent. Top assignee: Nan Ya Pcb Corp.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo-Chang Wu. Retrieved from https://idiyas.com/inventor/kuo-chang-wu-3qvhsc9z

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Kuo-Chang Wu: Innovator in Embedded Component Substrates

Introduction

Kuo-Chang Wu is a notable inventor based in Yilan County, Taiwan. He has made significant contributions to the field of electronics through his innovative designs and patents. His work focuses on enhancing the functionality and efficiency of electronic components.

Latest Patents

Kuo-Chang Wu holds a patent for an "Embedded component substrate and method for fabricating the same." This invention provides a substrate that includes at least one cavity and incorporates electronic components within it. The design features a first wiring layer that connects the electronic components to the substrate, ensuring efficient operation and integration.

Career Highlights

Wu is associated with Nan Ya PCB Corporation, where he applies his expertise in developing advanced electronic substrates. His work has contributed to the company's reputation for innovation in the printed circuit board industry.

Collaborations

Some of Kuo-Chang Wu's coworkers include Wei-Ta Fu and Yu-chih Lin, who collaborate with him on various projects within the company.

Conclusion

Kuo-Chang Wu's contributions to embedded component substrates exemplify the importance of innovation in the electronics industry. His patent reflects a commitment to advancing technology and improving electronic component integration.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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