Company Filing History:
Years Active: 1994-1998
Title: Kunihiko Nakashima: Innovator in Adhesive Technologies
Introduction
Kunihiko Nakashima is a prominent inventor based in Machida, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 2 patents. His innovative work focuses on developing materials that enhance adhesion and stability in various applications.
Latest Patents
Nakashima's latest patents include a photocurable silicone composition and a microcapsule type adhesive. The photocurable silicone composition is designed to be easy to manufacture, free of variations in adhesion, and effective as a potting material. This composition is created by adding a silanol terminated organosiloxane to an amino group-containing organodialkoxysilane, followed by a reaction with a vinyl group-containing isocyanate or other reactive agents. The resulting photocurable organopolysiloxane is combined with a photopolymerization catalyst. The microcapsule type adhesive is engineered to prevent the loosening of screws and similar applications. It boasts superior storage stability, adhesive force, and safety, comprising an epoxy resin core and various wall materials, along with a water-soluble binder and a curing agent.
Career Highlights
Nakashima is associated with Threebond Co., Ltd., a company known for its innovative adhesive solutions. His work has significantly impacted the industry, particularly in enhancing the performance and reliability of adhesive products.
Collaborations
He has collaborated with notable coworkers, including Osamu Hara and Satoshi Matsuo, contributing to the advancement of adhesive technologies through teamwork and shared expertise.
Conclusion
Kunihiko Nakashima's contributions to adhesive technologies through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the industry and improve product performance.