The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 1994
Filed:
Nov. 23, 1992
Applicant:
Inventors:
Satoshi Matsuo, Sagamihara, JP;
Ikuzo Usami, Tsukui, JP;
Makoto Kurihara, Akishima, JP;
Kunihiko Nakashima, Machida, JP;
Assignee:
Three Bond Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K / ; C08G / ; C09J / ; C09J / ;
U.S. Cl.
CPC ...
523206 ; 523207 ; 523208 ; 525 59 ; 525936 ;
Abstract
A microcapsule adhesive for preventing the loosening of screws and the like, which is superior in storage stability, adhesive force and safety, and which is comprised of an epoxy resin as a core material; a urea-formaldehyde resin, a melamine-formaldehyde resin, a polyurethane or a urea-urethane resin as a wall material; a water-soluble polyacetal resin binder; and a non-volatile, water-soluble or -dispersible amine-based curing agent.
Matsuo, Satoshi. (1994). Microcapsule type adhesive (U.S. Patent No. 5283266). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5283266
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile