Bengaluru, India

Kunal A Shah

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Intel Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kunal A Shah. Retrieved from https://idiyas.com/inventor/kunal-a-shah

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kunal A. Shah and Modular Computing Connectivity.

Introduction

Kunal A. Shah is an inventor based in Bengaluru, India, and is associated with Intel Corporation. His patent work addresses adaptable connectivity for computing devices.

Latest Patents

Shah is named on one patent, 1 patent: “Enabling Universal Core Motherboard with Flexible Input-Output Ports.” The invention describes a user-removable module with an input-output port configured for specifications such as USB-A, USB-C, Thunderbolt, DisplayPort, or HDMI. The module may use an expansion card, such as an M.2 card, to communicate with a host platform. A standardized interface can help the platform support different module types while reducing complexity and cost. A dual-port module can also allow power and data to be sent or received concurrently through separate ports.

Career Highlights

Shah’s listed work connects his inventive activity with Intel Corporation and focuses on modular hardware design. The patent describes a flexible approach to adding or changing connectivity options in computing devices.

Collaborations

Shah’s listed coworkers include Shailendra Singh Chauhan and Nirmala Bailur.

Conclusion

Kunal A. Shah’s patent presents a modular approach to flexible computer connectivity, with the potential to simplify how devices support different ports and functions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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