Gyeonggi-do, South Korea

Kun Young Lim

This inventor holds 1 USPTO granted patent and 5 published patent applications and 2 EPO patents. Top assignee: Hpsp Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun Young Lim. Retrieved from https://idiyas.com/inventor/kun-young-lim-1xg0tonz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kun Young Lim: Innovator in High-Pressure Heat Treatment Technology

Introduction: Kun Young Lim is an inventor based in Uiwang-si, Gyeonggi-do, South Korea. He is associated with Hpsp Co., Ltd. and has made significant contributions to the field of high-pressure heat treatment technology. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications: One of Kun Young Lim's notable patent applications is for a "High-Pressure Heat Treatment Apparatus and Gas Monitoring Module Used Therefor." This invention provides a high-pressure heat treatment apparatus that includes an inner chamber for accommodating objects for heat treatment, an outer chamber with a defined accommodation space, and a sophisticated monitoring module. The apparatus is designed to supply reaction gas at a higher pressure than atmospheric pressure and includes a control module to detect any internal gas leaks.

Conclusion: Kun Young Lim is an emerging inventor whose work in high-pressure heat treatment technology showcases his innovative spirit and potential for future contributions to the field. His latest patent application reflects a commitment to advancing technology in this area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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