The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Dec. 22, 2022
Applicant:

Hpsp Co., Ltd., Gyeonggi-do, KR;

Inventor:

Kun Young Lim, Gyeonggi-do, KR;

Assignee:

HPSP Co., Ltd., Gyeonggi-do, KR;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F27D 7/02 (2006.01); F27B 17/00 (2006.01); F27D 1/00 (2006.01); F27D 7/06 (2006.01); F27D 9/00 (2006.01); F27D 99/00 (2010.01); H01L 21/67 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
F27D 7/02 (2013.01); F27D 7/06 (2013.01); F27D 99/007 (2013.01); H10P 72/0431 (2026.01); H10P 72/0434 (2026.01); H10P 72/0436 (2026.01); H10P 72/0602 (2026.01); F27B 17/0025 (2013.01); F27D 2001/0059 (2013.01); F27D 2007/063 (2013.01); F27D 2009/0005 (2013.01); F27D 2009/001 (2013.01); F27D 2009/0013 (2013.01); H10P 72/0462 (2026.01);
Abstract

Provided is a high pressure heat treatment apparatus including: an internal chamber accommodating an object to be heat-treated; an external chamber including a housing and a partition plate partitioning the housing into a high-temperature zone accommodating the internal chamber and a low-temperature zone having a lower temperature than the high-temperature zone, the partition plate including a discharge hole for allowing the high-temperature zone and the low-temperature zone to communicate with each other; a gas supply module configured to supply a process gas for the heat treatment to the internal chamber at a first pressure higher than that of the atmosphere, and supply a protective gas to the high-temperature zone and the low-temperature zone at a second pressure set in relation to the first pressure; and a discharge module configured to open the discharge hole to discharge the protective gas in the high-temperature zone to the low-temperature zone.


Find Patent Forward Citations

Lim, Kun. (2026). High pressure heat treatment apparatus (U.S. Patent No. 12698939). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12698939

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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