Kun Shan Yang

Title: The Innovations of Kun Shan Yang

Introduction

Kun Shan Yang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of signal conversion technology, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is a "Signal Conversion Device with Dual Chip." This invention provides a dual chip signal conversion device that includes a carrier with multiple contacts and chips that facilitate efficient signal processing. The design incorporates an antenna that is electrically connected to the second chip, enhancing its functionality. Another patent is simply titled "Signal Conversion Device." This device features a substrate with distinct contact regions and an integrated circuit fabricated using advanced technologies such as Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF). This innovation allows for improved electrical connections and overall performance.

Career Highlights

Kun Shan Yang is currently associated with Phytrex Technology Corporation, where he continues to develop cutting-edge technologies. His work has positioned him as a key player in the field of signal conversion devices, contributing to advancements that benefit various applications.

Collaborations

He collaborates with talented individuals such as Feng Chi Hsiao and Tung Lin, who share his passion for innovation and technology. Together, they work towards creating solutions that push the boundaries of current technology.

Conclusion

Kun Shan Yang's contributions to signal conversion technology through his patents reflect his dedication to innovation. His work at Phytrex Technology Corporation and collaborations with fellow inventors further enhance the impact of his inventions in the industry.