The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2013

Filed:

Apr. 13, 2010
Applicants:

Feng Chi Hsiao, Taipei, TW;

Kun Shan Yang, Taipei, TW;

Tung Fu Lin, Taipei, TW;

Chin Fen Cheng, Taipei, TW;

Chih Wei Lee, Taipei, TW;

Inventors:

Feng Chi Hsiao, Taipei, TW;

Kun Shan Yang, Taipei, TW;

Tung Fu Lin, Taipei, TW;

Chin Fen Cheng, Taipei, TW;

Chih Wei Lee, Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.


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